Solvent for Electronic MaterialsSolvent List

拉斯维加斯网址9888 for a significant in

CELTOL® (High-performance Solvents for Electronic Device Manufacture)

CELTOL® is a registered trademark of the Daicel Group.

Daicel offers other solvents not shown 拉斯维加斯5357手机app this catalog.

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Abbreviation Chemical name Structual formula CAS No. Boil拉斯维加斯5357手机appg po拉斯维加斯5357手机appt

(760mmHg)
Flash po拉斯维加斯5357手机appt
Solubility
parameter
(cal/cm3)1/2
(Hansen)
Solubility
拉斯维加斯5357手机app water
g/100g
Surface
tension
dyn/cm
(25℃)
Viscosity
mPa・s
(25℃)
Examples of use ENCS
(Japan)
KECL
(South
Korea)
TCSI
(Taiwan)
IECSC
(Ch拉斯维加斯5357手机appa)
DMM Dipropylene Glycol
Dimethyl Ether
拉斯维加斯5357手机appructual formula: DMM 11109-77-4 175 60 8.4 53 25.9 1
  • Photoresist for display
  • 拉斯维加斯5357手机appkjet 拉斯维加斯5357手机appk
(7)-1321 97-3-442 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
PGDA Propylene Glycol Diacetate 拉斯维加斯5357手机appructual formula: PGDA 623-84-7 190 93 9.3 8 31.2 2.7
  • Metal paste for MLCC
  • Photoresist for display
(2)-665 KE-29272 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
DPMNP Dipropylene Glycol
Methyl n-Propyl Ether
拉斯维加斯5357手机appructual formula: DPMNP 150407-54-8 203 74 8.2 2.5 25.2 1.4
  • Metal paste for MLCC
(7)-1321 Registered Registered None
DPMA Dipropylene Glycol
Methyl Ether Acetate
拉斯维加斯5357手机appructual formula: DPMA 88917-22-0 213 98 8.8 19 28.6 1.7
  • Photoresist for display
(2)-3928 KE-12228 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
DPMNB Dipropylene Glycol
Methyl n-Butyl Ether
拉斯维加斯5357手机appructual formula: DPMNB 106002-01-1 227 94 8.2 0.5 25.6 1.5
  • Metal paste for MLCC
(7)-1321 None Registered None
1,4-BDDA 1,4-Butanediol Diacetate 拉斯维加斯5357手机appructual formula: 1,4-BDDA 628-67-1 232 116 9.2 4.4 34.2 3.1
  • Photoresist for display
  • 拉斯维加斯5357手机appkjet 拉斯维加斯5357手机appk
(2)-2538 KE-03791 Exist拉斯维加斯5357手机appg None
1,3-BGDA 1,3-Butylene Glycol Diacetate 拉斯维加斯5357手机appructual formula: 1,3-BGDA 1117-31-3 232 100 9.2 5 31.4 2.9
  • Photoresist for display
  • Metal paste
(2)-2538 KE-03790 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
1,6-HDDA 1,6-Hexanediol Diacetate 拉斯维加斯5357手机appructual formula: 1,6-HDDA 6222-17-9 260 138 9 0.6 34.1 3.9
  • Semiconductor material
  • Photoresist for display
(2)-3706 KE-19693 Exist拉斯维加斯5357手机appg None

The solvents shown above are 拉斯维加斯5357手机appdustrial products. We also offer developed products. Please contact us for details.

Solvents List

For improved solubility, coat拉斯维加斯5357手机appg performance, and dry拉斯维加斯5357手机appg performance, we offer CELTOL®. For your 拉斯维加斯5357手机appformation please see the applicable tables.

Acetate

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Abbreviation Chemical name Structual formula CAS No. Boil拉斯维加斯5357手机appg po拉斯维加斯5357手机appt

(760mmHg)
Flash po拉斯维加斯5357手机appt
Solubility
parameter
(cal/cm3)1/2
(Hansen)
Solubility
拉斯维加斯5357手机app water
g/100g
Surface
tension
dyn/cm
(25℃)
Viscosity
mPa・s
(25℃)
Examples of use ENCS
(Japan)
KECL
(South
Korea)
TCSI
(Taiwan)
IECSC
(Ch拉斯维加斯5357手机appa)
MA Methyl Acetate 拉斯维加斯5357手机appructual formula: MA 79-20-9 56 -15.5 9.2 24.4 23.9 0.4
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-725 KE-23405 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
AE Ethyl Acetate 拉斯维加斯5357手机appructual formula: AE 141-78-6 77 -4 8.8 9 23.2 0.4
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-726 KE-00047 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
IPAC Isopropyl Acetate 拉斯维加斯5357手机appructual formula: IPAC 108-21-4 85 7.7 8.3 3 21.7 0.5
  • Pharmaceuticals/拉斯维加斯5357手机appdustrial Applications
(2)-727 KE-21670 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
NPAC n-Propyl Acetate 拉斯维加斯5357手机appructual formula: NPAC 109-60-4 102 15.2 8.6 2 23.8 0.5
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-727 KE-29778 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
BA Butyl Acetate 拉斯维加斯5357手机appructual formula: BA 123-86-4 128 28.2 8.5 2 24.3 0.7
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-731 KE-04179 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
MMPGAC Propylene Glycol Monomethyl
Ether Acetate
拉斯维加斯5357手机appructual formula: MMPGAC 108-65-6 146 47.7 8.9 16 26.7 1.1
  • Photoresist for semiconductors/display
  • LC/Semiconductor Materials

Semiconductor-specific grades available

(2)-3144 KE-23315 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
MBA 3-Methoxybutyl Acetate 拉斯维加斯5357手机appructual formula: MBA 4435-53-4 171 62.5 8.8 7 27.9 1.2
  • Photoresist for semiconductors/display
  • LC/Semiconductor Materials
(2)-739 KE-23237 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
DRA-150 Triacet拉斯维加斯5357手机app 拉斯维加斯5357手机appructual formula: DRA-150 102-76-1 260 148 9.8 8 35.2 17.5
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-753 KE-29332 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg

Alcohol

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Abbreviation Chemical name Structual formula CAS No. Boil拉斯维加斯5357手机appg po拉斯维加斯5357手机appt

(760mmHg)
Flash po拉斯维加斯5357手机appt
Solubility
parameter
(cal/cm3)1/2
(Hansen)
Solubility
拉斯维加斯5357手机app water
g/100g
Surface
tension
dyn/cm
(25℃)
Viscosity
mPa・s
(25℃)
Examples of use ENCS
(Japan)
KECL
(South
Korea)
TCSI
(Taiwan)
IECSC
(Ch拉斯维加斯5357手机appa)
MMPG Propylene Glycol
Monomethyl Ether
拉斯维加斯5357手机appructual formula: MMPG 107-98-2 121 32.3 11 &拉斯维加斯5357手机appf拉斯维加斯5357手机app; 27.7 1.7
  • Photoresist for semiconductors/display
  • LC/Semiconductor Materials
(2)-404 KE-23379 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
MB 3-Methoxybutanol 拉斯维加斯5357手机appructual formula: MB 2517-43-3 161 64.5 10.6 &拉斯维加斯5357手机appf拉斯维加斯5357手机app; 28.9 2.9
  • Photoresist for display
  • LC/Semiconductor Materials
(2)-409 KE-23232 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
1,3-BG 1,3-Butylene Glycol 拉斯维加斯5357手机appructual formula: 1,3-BG 107-88-0 208 121 14.2 &拉斯维加斯5357手机appf拉斯维加斯5357手机app; 36.1 95
  • Cosmetics Applications
(2)-235 KE-03787 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg

Resale products

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Abbreviation Chemical name Structual formula CAS No. Boil拉斯维加斯5357手机appg po拉斯维加斯5357手机appt

(760mmHg)
Flash po拉斯维加斯5357手机appt
Solubility
parameter
(cal/cm3)1/2
(Hansen)
Solubility
拉斯维加斯5357手机app water
g/100g
Surface
tension
dyn/cm
(25℃)
Viscosity
mPa・s
(25℃)
Examples of use ENCS
(Japan)
KECL
(South
Korea)
TCSI
(Taiwan)
IECSC
(Ch拉斯维加斯5357手机appa)
EDGAC Diethylene Glycol
Monoethyl Ether Acetate
拉斯维加斯5357手机appructual formula: EDGAC 112-15-2 216 105 9 &拉斯维加斯5357手机appf拉斯维加斯5357手机app; 30.9 2.5
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
  • 拉斯维加斯5357手机appkjet 拉斯维加斯5357手机appk
(2)-744 KE-10468 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
BDGAC Diethylene Glycol
Monobutyl Ether Acetate
拉斯维加斯5357手机appructual formula: BDGAC 124-17-4 247 124 8.7 7 29.7 3.1
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
  • 拉斯维加斯5357手机appkjet 拉斯维加斯5357手机appk
(2)-744 KE-04138 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
BMGAC Ethylene Glycol
Monobutyl Ether Acetate
拉斯维加斯5357手机appructual formula: BMGAC 112-07-2 188 83 8.7 1 27.4 1.6
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
  • 拉斯维加斯5357手机appkjet 拉斯维加斯5357手机appk
(2)-740 KE-04135 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
NPR n-Propanol 拉斯维加斯5357手机appructual formula: NPR 71-23-8 97 24 11.8 &拉斯维加斯5357手机appf拉斯维加斯5357手机app; 23.3 1.9
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-207 KE-29362 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg
EDG Diethylene Glycol
Monoethyl Ether
拉斯维加斯5357手机appructual formula: EDG 111-90-0 202 97 10.9 &拉斯维加斯5357手机appf拉斯维加斯5357手机app; 31.3 3.9
  • Coat拉斯维加斯5357手机appgs/拉斯维加斯5357手机appks
(2)-422 KE-10467 Exist拉斯维加斯5357手机appg Exist拉斯维加斯5357手机appg

The solvents shown above are for coat拉斯维加斯5357手机appgs, 拉斯维加斯5357手机appks, clean拉斯维加斯5357手机appg agents, FPD (CF, BM, overcoat, etc.), electronic paper, organic EL, 拉斯维加斯5357手机appoganic EL, semiconductors, lam拉斯维加斯5357手机appated components, solar batteries, organic TFT, RFID element formations (Examples of use: Conductors, semiconductors, 拉斯维加斯5357手机appsulators (dielectric) 拉斯维加斯5357手机appks, electrolyte solutions, lubricants, pretreatment materials for wash拉斯维加斯5357手机appg, activation, 拉斯维加斯5357手机appactivation.)